As AI and cloud workloads continue to grow, data centers require smarter, high-speed connectivity solutions. Amphenol’s XPO OverPass™ Assembly is engineered to maximize the performance of 12.8T XPO-LPO optical transceivers, delivering exceptional signal integrity, scalable bandwidth, and up to 4x the front I/O density of traditional OSFP solutions. Designed for AI clusters and hyperscale data centers, OverPass™ enables reliable, high-speed connectivity from chip to front panel.
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