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Data Center

This video shows how Amphenol solved a design challenge in a Data Center application and provided a solution to meet the following requirements: • Transmission loss using copper PCB for 56G and higher data rates • Need for expensive retimers hurting BOM cost and power budget • High reliability solution OverPass™ Cable Interconnects were chosen for these reasons: • Direct high speed cabled interconnect from near chip / on package to external port eliminates excessive PCB signal loss • High density near chip / on package IO products enables high DP count chip sets (minimized PCB area) • Fully integrated, tested, labeled and packaged solution- aligned with CM practices

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