Amphenol engineers discuss high speed & power connections: BGA technology and power solutions. The video showcases Amphenol's advanced manufacturing supporting a patented BGA interconnect design. Multiple in-process vision systems monitor BGA contact integrity including solder sphere size, location, and co-planarity plus other critical-to-function attributes. The MEG-Array® Mezzanine Connector system provides the high density and high-speed benefits of a large array supported by the reliability and low costs of standard surface mount PCB assembly. 1.27mm x 1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high-speed signal integrity at speeds up to 32Gb/s. MEG-Array® is offered in a variety of PCB mezzanine stack heights.