This video shows how Amphenol solved a design challenge in a Test Solution for 112G/224G SerDes Development application and provided a solution to meet the following requirements: • Excessive loss through device socket and PCB at high speed • Limited options for launching signals from top of the device • Real estate constraints on device substrate • Unreliability of soldered down snap-in connectors TR™ Multicoax Series Custom Package Top Launched Connectors were chosen for these reasons: • Compression mount solderless technology • Signal integrity out past 67 GHz • Integration with Ardent's SK™ Series Test Socket • Reusability across multiple programs promotes cost saving